Verified hardware compatibility guide and parts catalog. Upgrading your PlayStation 5 DualSense with back remap paddles on the BDM-040 (Gen 4) motherboard architecture.
Fourth generation. Look for a 'C' suffix. Shares ribbon compatibility with BDM-030 but has a revised power management IC.
Internal ribbon pinouts and trigger brackets change with each revision. Select your board version below or plug in via USB for instant hardware detection.
First-generation launch model. Model CFI-ZCT1W without a letter suffix. FCC ID ends in no letter. Features large trigger torsion springs and standard 23-pin main ribbon.
Second generation. Look for an 'A' after the model CFI-ZCT1W and FCC ID ending in 'A'. Features smaller trigger torsion springs and updated microphone cable.
Third generation (common on newer consoles). Look for a 'B' after the model number. Features redesigned smaller adaptive trigger motor housings and a completely different ribbon pinout.
Fourth generation. Look for a 'C' suffix. Shares ribbon compatibility with BDM-030 but has a revised power management IC.
Adds 2 or 4 ergonomic remappable tactile buttons/paddles to the back shell for competitive jumping, sliding, and weapon swapping without lifting thumbs.
Yes. Every part featured on this page has been verified to match the specific circuit traces, ribbon cable pitch, and internal housing brackets of the BDM-040 (Gen 4) revision.
Fourth generation. Look for a 'C' suffix. Shares ribbon compatibility with BDM-030 but has a revised power management IC. You can also connect your controller via USB to run the WebHID auto-detector above.
Most kits require a PH00 Phillips screwdriver, plastic prying pry tools, and tweezers. If installing Hall Effect joysticks, a soldering iron, desoldering pump/wick, and solder flux are also required.